3D Inspection Solutions

Semi mems & imaging sensors summit to highlight new innovation opportunities to drive a sustainable future

GRENOBLE, France – August 22, 2023 – More than 40 experts will gather September 19-21 at the SEMI MEMS & Imaging Sensors Summit to share insights into new innovation opportunities for MEMS, imaging and sensors applications and their potential to enable a smarter and more sustainable world. Registration is open for the exhibition and conferences at the World Trade Center (WTC) in Grenoble, France.

Themed Ubiquitous Sensing for A Sustainable World, the summit will explore the latest MEMS, imaging and sensors technologies, developments and trends. The event is hosted by SEMI Europe and the MEMS & Sensors Industry Group (MSIG), a SEMI Technology Community.

Rapid progress in the development and manufacture of MEMS and image sensors products featuring artificial intelligence (AI) and machine learning is leading a new wave of innovative applications.

3D Inspection Solutions | Koh Young America

Laith Altimime, President of SEMI Europe

We look forward to hosting industry thought leaders as they share their visions for how new advances promise to drive more eco-friendly products and applications.

Laith Altimime, President of SEMI Europe

Featured Speakers at MEMS & Imaging Sensors Summit

Thought leaders will discuss MEMS and imaging sensors manufacturing advances and how the latest innovations are powering intelligent applications across sectors such as communications, mobility, IoT, entertainment and medical.

HSHod Finkelstein, Head of Cameras and Depth, Reality Labs
Meta
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ImageBernard Kress, Director of Optical Engineering, Augmented Reality Hardware
Google
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HSLia Li, ZPM Co-founder and CEO
Zero Point Motion
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HSKilian Bilger, Vice President of Engineering Sensor Components
Bosch
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HSTheodor Nielsen, CEO
NIL Technology (NILT)
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HSIsabella Drolz, Vice President of Product Marketing
Comet Yxlon
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HSMoti Margalit, CEO
SonicEdge
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HSMartin Croome, Vice President of Marketing
GreenWaves Technologies
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HSJulia Brueckner, Global Applications & Product Engineering Manager for Packaging & Wafer Business Unit
Corning Incorporated
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Gala Dinner and Networking Opportunities

The SEMI MEMS & Imaging Sensors Summit will feature networking opportunities including a complimentary welcome reception on September 19 in the exhibition area at the WTC and a gala dinner on September 20. Registration for the gala dinner at the Chateau de Sassenage is open.

Industry Leaders Exhibiting at MEMS & Imaging Sensors Summit

  • Adeia
  • AEMtec
  • Besi
  • Comet Yxlon
  • Eurofins | MASER
  • EV Group (EVG)
  • FormFactor
  • OPTIM Wafer Services
  • Philips MEMS & Micro Devices
  • Polyteknik AS
  • ProSys
  • Pyxalis
  • SET Corporation
  • Siconnex
  • Siemens EDA (represented by EDA Solutions Limited)
  • Sumitomo Precision Products
  • SUSS Microtec
  • L. Gore & Associates

Premier Sponsors

For more information, please visit the SEMI MEMS & Imaging Sensors Summit website.

Stay in touch on Twitter @SEMIEurope: #MEMSSummit #MEMS #Imaging #SEMIEurope

About SEMI 
SEMI® connects 3,000 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG), Nano-Bio Materials Consortium (NBMC), and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter to learn more. 

Association Contacts 

Serena Brischetto/SEMI Europe 
Phone: +49 30 3030 8077-11 
Email: sbrischetto@semi.org 

Michael Hall/SEMI US 
Phone: 1.408.943.7988 
Email: mhall@semi.org

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