3D Inspection Solutions

Molded Interconnect Device Market: Advancing Innovation and Integration in Electronics Manufacturing by 2030

The Moulded Interconnect Device (MID) Market is expected to increase from USD 1.3 billion in 2023 to USD 3.1 billion by 2030, rising at a CAGR of 13.4% between 2023 and 2030.


The market for Moulded Interconnect Devices (MID) is driven by the rise in demand for electronic component integration and miniaturisation. Multiple capabilities can be combined into a single moulded part using MIDs, which reduces size, weight, and system complexity. The availability of speciality thermoplastics and improvements in manufacturing techniques like laser direct structuring (LDS) technology both contribute to the market’s expansion. Opportunities are available in the industry for ITS, regenerative energy integration, and automotive applications. For broader MID usage, issues with standardisation and manufacturing practises must be resolved.


The growing demand for the integration and miniaturisation of electronic components is one of the main factors driving the Moulded Interconnect Device (MID) market. Circuitry, mechanical components, and antennae can all be integrated into a single three-dimensional moulded object thanks to MIDs. This integration reduces size, weight, and overall system complexity by doing rid of the requirement for separate components and labor-intensive assembly procedures. MIDs offer a practical response to the growing demand for small, light, and tightly integrated electronic systems as a result of the miniaturisation trend in a number of sectors, including automotive, consumer electronics, and healthcare. MIDs are a top choice for manufacturers looking for creative and space-saving solutions due to their ability to combine capabilities and minimise space needs.


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Recent Development in Molded Interconnect Device Market

  • Miniaturization and Integration: One of the significant recent developments in the MID market is the advancement in miniaturization and integration capabilities. Manufacturers are now able to create smaller and more compact MIDs with complex geometries, allowing for the integration of multiple functions and components into a single MID part. This trend has led to improved product designs and space-saving solutions across various industries.
  • Enhanced Material Technologies: Material innovations have played a crucial role in the development of MIDs. Recent advancements in materials, such as laser-sensitive additives and conductive inks, have resulted in higher-performance MIDs with better electrical conductivity and increased durability. These enhanced materials open up new possibilities for applications in harsh environments and high-reliability industries.
  • 3D Printing and Rapid Prototyping: The adoption of 3D printing and rapid prototyping technologies has accelerated the design and development process of MIDs. Manufacturers can now create prototypes quickly and cost-effectively, facilitating faster iterations and product improvements. This has reduced time-to-market and enabled better customization to meet specific customer requirements.
  • Integration of Smart Features: MIDs are increasingly incorporating smart features, such as RFID (Radio-Frequency Identification) technology, NFC (Near Field Communication) capabilities, and sensor integration. These functionalities enable MIDs to interact with other devices, collect data, and provide valuable insights for various applications, including IoT (Internet of Things) devices and smart packaging solutions.
  • Growing Applications in Automotive and Healthcare Industries: The automotive and healthcare sectors have witnessed significant recent developments in the adoption of MIDs. In the automotive industry, MIDs are being used for various applications, including interior controls, lighting systems, and sensors. In healthcare, MIDs are finding applications in medical devices and wearables, enabling compact and cost-effective solutions.

Major Classifications are as follows:

  • By Material Type:
    • Plastics
    • Metals
    • Ceramics
  • By Process:
    • Laser Direct Structuring (LDS)
    • Two-Shot Molding
    • Injection Molding
    • Hybrid Molding
  • By Function:
    • Antenna
    • Sensor
    • Connector
    • Switch
    • Lighting
    • Others
  • By End-User Industry:
    • Electronics
    • Automotive
    • Healthcare
    • Aerospace and Defense
    • Industrial
  • By Region
    • North America
      • US
      • Canada
    • Latin America
      • Brazil
      • Mexico
      • Argentina
      • Rest of Latin America
    • Europe
      • UK
      • Germany
      • France
      • Italy
      • Spain
      • Russia
      • Rest of Europe
    • Asia Pacific
      • China
      • Japan
      • India
      • South Korea
      • Rest of Asia Pacific
    • Rest of the World
      • Middle East
        • UAE
        • Saudi Arabia
        • Israel
        • Rest of the Middle East
      • Africa
        • South Africa
        • Rest of Middle East & Africa      

 Key Players

LPKF Laser & Electronics AG, Harting Technology Group, Molex LLC, TE Connectivity Ltd., HARTING Mitronics AG, MacDermid Alpha Electronics Solutions, Aptiv PLC, Sumitomo Electric Industries, Ltd., DSBJ (Dongguan Shengjin Electronics Technology Co., Ltd.), Cicor Group, MacDermid Enthone Industrial Solutions, Johnan Manufacturing Inc., and Others

Key Questions Addressed by the Report

• What are the growth opportunities in the Molded Interconnect Device Market?
• What are the major raw materials used for manufacturing Molded Interconnect Device Market?
• What are the key factors affecting market dynamics?
• What are some of the significant challenges and restraints that the industry faces?
• Which are the key players operating in the market, and what initiatives have they undertaken over the past few years

Molded Interconnect Device Market Frequently Asked Questions (FAQs):

  • What are the challenges of microgrid control?
  • What is the standard for the specification of microgrid controllers?
  • What are the advantages of using MIDs?
  • What is the role of MIDs in the Internet of Things (IoT)?

About MarketDigits:

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