3D X-Ray Inspection

Automated X-ray inspection (AXI) is a sophisticated technology that plays a crucial role in the electronics manufacturing industry. This process involves using X-ray imaging to inspect the internal structures of electronic components and devices, detecting defects that are not visible to the naked eye. AXI ensures the highest levels of quality and reliability in electronic components and devices, by identifying and addressing issues early in the production process.

AXI is typically used to inspect electronic components and devices that are densely packed or have hidden features, such as ball grid array (BGA) devices or through-hole components. The technology utilizes advanced imaging algorithms to generate high-resolution X-ray images of these components, enabling inspectors to detect defects such as voids, cracks, and misalignments.