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SMT Equipment Market is expected to Size and Analysis, Forecast to a valuation of US$ 9,025.3 Mn by the end of 2030 – Reports and Insights
The recently published report titled, “SMT Equipment Market: Opportunity Analysis and Future…
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Indium Corporation Introduces New Package-Attach Solder Preform Technology at Productronica
Indium Corporation® is proud to introduce a novel alloy technology that enables lower processing temperatures in preform soldering, at Productronica 2023, November 14-17, in Munich, Germany. Specifically developed for power module package-attach applications, Indalloy®301-LT…
Carling Technologies Expands Circuit Protection with R-Series DIN Rail Breaker
PLAINVILLE, September 21, 2023 -- Carling Technologies, a Littelfuse, Inc. (NASDAQ: LFUS) brand, announced the introduction of the new R-Series configurable 13 mm DIN rail mount hydraulic-magnetic circuit breaker. Available with up to four…
ADAS and Electric Vehicles Boost Demand for Passive Components
Published: 9.19.2023 As reported by Digitimes Asia, passive component manufacturers based in Taiwan are eyeing the automotive sector to boost their revenue in the latter half of the year. This…
ViTrox’s V510i 3D AOI Receives Prestigious Recognition: 2023 Mexico Technology Award!
PENANG, MALAYSIA - OCTOBER 2023 ViTrox, which aims to be the world’s most trusted technology company, is honoured to announce…
Renishaw hosts UK forum for 3D gurus
Innovators and tech leaders gathered at Renishaw's HQ in Gloucestershire today to share ideas and intelligence on the additive manufacturing…
Why Advanced Micro Devices, Taiwan Semiconductor Manufacturing, and Dell Technologies Plunged Today
What happened Shares of semiconductor giants Advanced Micro Devices (AMD 0.95%), Taiwan Semiconductor Manufacturing (TSM -0.31%), and Dell Technologies (DELL -2.45%) were all falling on Wednesday, down 5.2%, 3.7%, and…
NDIA Policy Points: Additive Manufacturing Can Revolutionize Industry
The impact of the COVID-19 pandemic continues to reverberate throughout the global economy. Supply chains and logistics — once mundane and arcane topics — have gone mainstream and are grabbing…
NextFlex® Launches $4.4 Million Funding Opportunity to Strengthen U.S. Electronics Manufacturing and Advance Adoption of Hybrid Electronics
SAN JOSE, Calif.--(BUSINESS WIRE)--NextFlex, America’s Flexible Hybrid Electronics (FHE) Manufacturing Institute, today released Project Call 8.0 (PC 8.0), the latest…
TSMC Announces Breakthrough Set to Redefine the Future of 3D IC
SANTA CLARA, CA, September 27, 2023 – TSMC (TSE: 2330, NYSE: TSM) today announced the new 3Dblox 2.0 open standard and major achievements…
MediaTek Develops First 3nm Chip, Set for 2024 Production
Hsinchu, Taiwan, R.O.C., Sep. 7, 2023 – MediaTek and TSMC (TWSE: 2330, NYSE: TSM) today announced that MediaTek has successfully developed…
